Development Prospects Of Flexible Circuit Boards

FPC will continue to innovate in four aspects in the future, mainly in:

1. Thickness. The thickness of FPC must be more flexible and thinner;

2. Folding resistance. The ability to bend is an inherent characteristic of FPC. In the future, FPC must have stronger folding resistance and must exceed 10,000 times. Of course, this requires a better substrate;

3. Price. At this stage, the price of FPC is much higher than that of PCB. If the price of FPC comes down, the market will definitely be much wider.

4. Technological level. In order to meet various requirements, the FPC process must be upgraded, and the minimum aperture and minimum line width/line spacing must meet higher requirements.